USPTO Patent Search

🔎 Search U.S. patents for prior-art research

Patent researchers, IP teams, R&D teams, and developers can search public U.S. patent records from the official USPTO data service. Enter one keyword, phrase, or source-compatible Boolean query and get structured patent and published application data for prior-art and patent research. Each saved row can include identifiers, titles, abstracts, owners, inventors, dates, classifications, claims, citations, family details, and official source links when the source provides them.

Use one run for one search setup. The Actor runs without a source credential and does not give legal advice, patentability opinions, freedom-to-operate conclusions, or infringement analysis.

Try these focused searches:

• Search U.S. patents with USPTO patent search for a topic or Boolean query.
• Find published pending filings with Patent Application Search when applications are in scope.
• Focus on design documents with Design Patent Search for a design-related query.
• Look for pending filings with Patent Pending Search and a focused query.
• Filter by organization with Patent Search by Assignee to review one owner's filings.
• Filter by person with Patent Search by Inventor to review one inventor's filings.
• Look up a known identifier with Patent Number Search and inspect matching records.

📄 Structured patent records

One saved row is one matching U.S. patent or published application. The identifiers object can include patent, application, and publication numbers. A row can include a title, abstract, assignees, applicants, inventors, filing, publication, grant, and priority dates, document type, status, CPC classes, claims, backward citations, citing-patent count, family size, public source details, and a source-confidence signal.

The source may not provide every optional field for every row. Missing optional data is left out rather than guessed. Required rows include at least one identifier, a title, source details, document type, and status.

▶️ Run one focused patent search

Enter the required query and patent scope, then add the filters that match your research question. You can choose patent types, assignees, inventors, CPC classes, status categories, a date field and date window, and a publication-date order.

Set Maximum results when you want to stop after a positive number of records. Leave it empty to return all available results until the source is exhausted. The input schema does not define a fixed upper bound for this field.

Each run uses one search setup. Start the run, then open the results link to review the returned dataset rows.

⚙️ Input

Input fields

Field	Type	What it does
query	string	Required. Enter one keyword, phrase, or source-compatible Boolean query.
patentScope	enum string	Required. Choose whether to search granted patents only or include published pending applications.
patentTypes	array of strings	Optional. Choose one or more patent types. Leave it empty to include all types supported by the source. patentScope controls whether granted patents only or published pending applications are included.
assignees	array of strings	Optional. Add one or more assignee, owner, or applicant names. Results must match at least one name in this list.
inventors	array of strings	Optional. Add one or more inventor names. Results must match at least one name in this list.
cpcClasses	array of strings	Optional. Add one or more Cooperative Patent Classification codes, such as H01M or G06F.
statuses	array of strings	Optional. Choose one or more source-supported patent status categories.
dateField	enum string	Choose which patent date the optional dateFrom and dateTo fields filter. The choice is ignored when both date fields are empty.
dateFrom	date string	Optional. Start of the inclusive date window in YYYY-MM-DD format.
dateTo	date string	Optional. End of the inclusive date window in YYYY-MM-DD format.
sortBy	enum string	Optional. Choose the publication-date order for returned records.
maxItems	integer	Optional Actor Work Limit. Enter a positive number to stop after that many records. Leave it empty to return all available results until the source is exhausted.

Default input example

This JSON is copied from the successful current-beta default-input run:

{
  "query": "semiconductor",
  "patentScope": "granted",
  "patentTypes": [
    "utility"
  ],
  "dateField": "filing",
  "sortBy": "publication-desc",
  "maxItems": 20
}

🧾 Output

Run output link

Field	Type	What it does
results	URL string	Opens the patent records returned by the search in the default dataset overview.

Patent record fields

Every dataset row follows this one public shape. Optional source fields may be absent when the source does not provide them.

Field	Type	What it does
identifiers	object	Holds stable patent, application, and publication identifiers. At least one identifier is returned.
identifiers.patentNumber	string	Number assigned to a granted U.S. patent, when provided by the source.
identifiers.applicationNumber	string	Application identifier returned by the source, when provided.
identifiers.publicationNumber	string	Publication identifier returned by the source, when provided.
title	string	Title of the patent or published application.
abstract	string	Abstract or source summary, when provided.
assignees	array of strings	Names of assignees or owners returned by the source.
applicants	array of strings	Names of applicants returned by the source.
inventors	array of strings	Names of inventors returned by the source.
filingDate	date string	Filing date returned by the source.
publicationDate	date string	Publication date returned by the source.
grantDate	date string	Grant date returned by the source, when provided.
priorityDates	array of date strings	Priority dates returned by the source, when provided.
documentType	string	Patent or application document type returned by the source.
status	string	Application or grant status returned by the source.
cpcClasses	array of strings	Cooperative Patent Classification codes returned by the source.
claimCount	integer	Number of claims reported by the source, when provided.
claims	array of strings	Patent claims text returned by the source, when provided.
backwardCitations	array of strings	Prior-art citation references returned by the source, when provided.
citingPatentCount	integer	Number of citing patents reported by the source, when provided.
familySize	integer	Patent family size reported by the source, when provided.
source	object	Holds public source details for this patent record.
source.url	URL string	Public source page for this patent record.
source.name	string	Name of the originating public source.
source.jurisdiction	string	Jurisdiction of the patent record.
sourceConfidence	number or string	Confidence or provenance signal returned by the source, when provided.

Genuine current-beta row

This complete row is from the successful current-beta default-input run for semiconductor. It shows a utility patent with claims, citations, CPC classes, ownership, dates, and public source details.

{
  "identifiers": {
    "patentNumber": "US-12745670-B2",
    "applicationNumber": "17/927601"
  },
  "title": "Encapsulation techniques",
  "documentType": "utility patent",
  "status": "granted",
  "source": {
    "url": "https://ppubs.uspto.gov/basic/#US-12745670-B2",
    "name": "USPTO Patent Public Search",
    "jurisdiction": "US"
  },
  "abstract": "An integrated circuit (IC) assembly and a method for encapsulating of IC are presented. The IC assembly comprises an IC substrate having one or more micro-devices, at least one dielectric matrix element placed on said IC substrate over at least one of its one or more micro-devices; and an encapsulation element applied over said IC substrate and said at least one dielectric matrix element placed thereon to enclose and seal said IC substrate.",
  "assignees": [
    "ELTA SYSTEMS LTD."
  ],
  "applicants": [
    "ELTA SYSTEMS LTD."
  ],
  "inventors": [
    "Shapir; Itzhak",
    "Kedem; Michael"
  ],
  "grantDate": "2026-09-22",
  "cpcClasses": [
    "H01L23/24",
    "H01L21/56",
    "H01L23/29",
    "H01L23/31",
    "H01L23/66",
    "H01L25/065",
    "H10W44/20",
    "H10W74/01",
    "H10W74/10",
    "H10W74/47",
    "H10W76/47",
    "H10W90/00",
    "H10W74/016",
    "H10W74/114",
    "H10W44/241"
  ],
  "claimCount": 15,
  "claims": [
    "1. An integrated circuit (IC) assembly, comprising: an IC substrate having one or more micro-devices; at least one dielectric matrix element placed on said IC substrate over at least one of its one or more micro-devices; and an encapsulation element applied over said IC substrate and said at least one dielectric matrix element placed thereon to enclose and seal said IC substrate; and at least one spacer element placed on the at least one dielectric matrix element, the at least one spacer element partitioning between the at least one dielectric matrix element and the encapsulation element, and wherein the at least one spacer element is a detached portion removed from an aligning element configured to accurately place the at least one dielectric matrix element on the IC substrate; and wherein the at least one dielectric matrix element comprises a plurality of loop, hook, and/or bristle elements.",
    "2. The IC assembly of claim 1 wherein the at least one spacer element is a sheet of electrically insulating material having thickness in a range of 0.1 to 0.3 millimeters.",
    "3. The IC assembly of claim 2, wherein the at least one dielectric matrix element is made of at least one of: a thin film or foil, a breathable material, a permeable material, a cellular material, a fibrous material.",
    "4. The IC assembly of claim 1, wherein the at least one dielectric matrix element is made of at least one of: a thin film or foil, a breathable material, a permeable material, a cellular material, a fibrous material.",
    "5. The IC assembly of claim 1, wherein the encapsulation element comprises plastic or resin mold.",
    "6. The IC assembly of claim 1, further comprising a circuit board electrically coupled to the IC substrate and its one or more micro-devices.",
    "7. The IC assembly of claim 6, further comprising one or more electrical conductors electrically coupled to the circuit board and extending through the encapsulation element to provide electrical connectivity to said circuit board.",
    "8. The IC assembly of claim 1, wherein the at least one dielectric matrix element is made of at least one of: a thin film or foil, a breathable material, a permeable material, a cellular material, or a fibrous material.",
    "9. A multilayered circuit structure, comprising: at least one integrated circuit (IC) assembly and at least one additional circuit board having one or more devices and/or ICs attached thereto, the at least one IC assembly comprising: an IC substrate having one or more micro-devices; a circuit board electrically coupled to the IC substrate and its one or more micro-devices; at least one dielectric matrix element placed on said IC substrate over at least one of its one or more micro-devices; and an encapsulation element applied over said IC substrate and said at least one dielectric matrix element placed thereon to enclose and seal said IC substrate; wherein said at least one additional circuit board is attached and electrically coupled to said at least one IC assembly to form a stack structure.",
    "10. The multilayered circuit structure of claim 9, further comprising one or more electrical conductors electrically extending through the encapsulation element to provide electrical connectivity between the at least one IC assembly and the at least one additional circuit board.",
    "11. The multilayered circuit structure of claim 10, further comprising at least one via formed in the at least one additional circuit board for establishing electrical connectivity with at least one of the one or more electrical conductors.",
    "12. A method of encapsulating an integrated circuit (IC) including one or more micro-devices, the method comprising: placing at least one dielectric matrix element on an IC substrate over at least one of one or more micro-devices thereof; and applying an encapsulation mold over said IC substrate and said at least one dielectric matrix element placed thereon to enclose and seal said IC substrate; wherein the placing of the at least one dielectric matrix element comprises attaching the at least one dielectric matrix element to a carrier element configured to facilitate accurate placement of the at least one dielectric matrix element on the IC substrate.",
    "13. The method of claim 12, further comprising placing the at least one dielectric matrix element with a spacer element thereon.",
    "14. The method of claim 12, further comprising removing the carrier element before applying the encapsulation coat.",
    "15. The method of claim 14 wherein the removing of the carrier element comprises detaching at least one portion of the carrier element located on said at least one dielectric matrix element."
  ],
  "backwardCitations": [
    "5889232",
    "7700414",
    "9346668",
    "2003/0159262",
    "2007/0035001",
    "2012/0067871",
    "2014/0268625",
    "2016/0133537",
    "2017/0103973",
    "2017/0338161"
  ],
  "sourceConfidence": "USPAT",
  "familySize": 2,
  "citingPatentCount": 0
}

💳 Pricing

Pay per event: $0.0027 for each matching U.S. patent or published application saved to the dataset after a successful search. See the Pricing tab for the active billing details.

🔌 Integrations

Open the results link in Apify, export the default dataset, or use the dataset URL in an Apify API workflow.

For a short walkthrough:

❓ FAQ

Can I search published pending applications?

Yes. Set patentScope to granted-and-pending, then use statuses to focus on pending or granted records. Patent types can narrow the document types in the same search.

Can I filter by owner, inventor, CPC class, or date?

Yes. Add assignees, inventors, CPC classes, and a date window. Choose dateField to filter by filing, publication, or grant date, then set the optional inclusive dateFrom and dateTo values.

Is this a Google Patents search?

No. This Actor searches public U.S. patent records from the official USPTO data service. It is not a Google Patents search or an international patent search.

Can I search outside the United States?

No. The scope is public U.S. patent records. The Actor does not provide international or worldwide patent coverage.

What does a missing output field mean?

The source may not provide every optional field for every patent. Missing optional data is left out rather than guessed. Required rows still include at least one identifier, a title, source details, document type, and status.

Is the maximum result count required?

No. Enter a positive maxItems value to stop after that many records, or leave it empty to return all available results until the source is exhausted.

Does this give legal advice or a patentability opinion?

No. It returns public records for research. It does not give legal advice, patentability opinions, freedom-to-operate conclusions, or infringement analysis.

📝 Changelog

v0.0 (27-09-2026)

• Initial release.

🆘 Support

For issues, questions, or feature requests, file a ticket and I'll fix or implement it in less than 24h 🫡

🔗 Related Actors

• CourtListener Scraper: Search public opinions and federal dockets for legal research around a patent topic.
• Federal Register Scraper — Rules & Regulations: Find official U.S. rules, notices, and citations that may affect a technology area.
• ORCID Researcher Profile Search: Find public researcher profiles, affiliations, works, and identifiers when exploring inventors or a technical field.
• USPTO Patent Search — Prior-Art, Citations & Patent Data: Compare another U.S. patent workflow for prior-art, citation, and patent-data research.
• Google Patents Intelligence: Claims, Citations, Family Tree: Use a broader Google Patents workflow when you need family, citation, or PDF-link data across jurisdictions.

Made with ❤️ by Maxime Dupré